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85 best matches
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With salary
Young companies
≤ 5 yrs
Profitable companies
Ranked by keyword. Search by meaning is busy right now.
Senior Principal Analyst, Semiconductor Advanced Packaging
Informa Group Plc.
Taipei, Taiwan
Hybrid
Senior
4 weeks ago
New on Evolc
Remote-friendly
Semiconductor Package Development Engineer
Universal Quantum
Tokyo, Japan
On-site
Senior
16 Jun 2026
Advanced Packaging & Integration Lead
Equal1
Dublin, Delft
Hybrid
Lead
6 weeks ago
Advanced Assembly Engineer (2.5-3D)
Universal Quantum
Singapore, Singapore
On-site
5 Aug 2026
N
Internship - Reliability of Advanced Semiconductor Packages
Nxp
Nijmegen, Netherlands
Intern
Internship
8 weeks ago
New on Evolc
A
Packaging Development Engineer
Alpsemi
Toulouse, France
On-site
Senior
today
Young company
New on Evolc
Head of Device Fabrication, Advanced Packaging and Assembly
Universal Quantum
Singapore
Remote
Head
5 weeks ago
N
Senior Principal Power Packaging Architect
Nxp
United States, France, Austria +13
Senior
yesterday
New on Evolc
Advanced Packaging Development Engineer
Intel
Phoenix, United States
Hybrid
Mid-level
8 days ago
New on Evolc
Remote-friendly
Salary transparent
$133,800–188,890 / year
Semiconductor Product Engineering Team Leader
Fractile
Bristol, United Kingdom
Lead
29 May 2026
Young company
Oregon Advanced Packaging Module Engineer - Laser
Intel
Hillsboro, United States
On-site
Junior
11 days ago
New on Evolc
Remote-friendly
Salary transparent
$89,010–125,660 / year
Optical Interconnect Architect
Plessey Semiconductors
Oxford, United Kingdom
Senior
6 days ago
New on Evolc
Oregon Advanced Packaging Module Engineer
Intel
Hillsboro, United States
On-site
7 days ago
New on Evolc
Remote-friendly
Salary transparent
$76,390–146,440 / year
Semiconductor Test Engineering Team Leader
Fractile
London, Bristol, United Kingdom
Lead
6 days ago
Young company
Semiconductor Test Engineering Team Leader
Fractile
Bristol, United Kingdom
Lead
18 Dec 2025
Young company
Packaging Module Equipment Development Engineer
Intel
Phoenix, Chandler, United States
On-site
8 days ago
New on Evolc
Remote-friendly
Salary transparent
$133,800–188,890 / year
tesi/semiconductor
Leonardocompany
Rome, L'Aquila, Italy
Intern
Internship
5 weeks ago
New on Evolc
Remote-friendly
Salary transparent
Advanced Package Technology Principal Engineer
Lumilens
San Jose, United States
Senior
22 Mar 2026
R&D Laser Engineer (Laser & Spectrometer Development, Prototyping)
Quantune Technologies
Berlin, Germany
On-site
Senior
3 weeks ago
New on Evolc
Packaging Module Development Engineer
Intel
Chandler, Phoenix, United States
On-site
Junior
11 days ago
New on Evolc
Remote-friendly
Salary transparent
$133,800–188,890 / year
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